It has been announced that, in 2015, Intel will be joining Samsung in the use of NAND die stacking. This three dimensional stacking technique allows for chip layers to be stacked in vertical instead of horizontal planar structures. As they enter into this innovative field of technology, the company has big plans for its utilization.
Upping the Ante
NAND flash development has proven highly beneficial in reducing the cost per bit as well as increasing chip capacity. With this technology, Intel will be able to allow their flash memory to compete with alternatives like hard discs, and there is definitely demand for the technology. Among the uses for NAND include:
- MP3 files
- Digital cameras
- USB drives
- NAND flash
As Intel prepares to make their big announcement, it is speculated that they have followed Samsung’s lead in the utilization of a larger process node. Since the reliability of the device decreases along with the node size, this could help their launch of the use of NAND to be a success.
A Variety of User-End Features to Take Advantage Of
Technology can be complicated, but, all jargon aside, there are a number of exciting features for the end user to be excited about in regards to Intel’s utilization of NAND technology including:
- High-performance memory
- Maximum-value memory
- Dual-plane mode which nearly doubles memory
- Cache mode which enhances performance
Enhancing User Experience
Intel is dedicated to enhancing the overall user experience, and they have big plans for their upcoming use of NAND technology to achieve this goal. With over 20 years of industry experience in flash memory, they have plans for the expansion of NAND through its integration into Intel Architecture computing platforms. The end result will be improved battery life and a boost in performance. They are well prepared to meet growing demands as they plan to open multiple new manufacturing facilities over the next several years where state-of-the-art equipment will be in place and ready to implement NAND technology.